Die Attach and SMD Adhesives

We provide a comprehensive portfolio of high-performance adhesives engineered for the electronics industry. Our die attach and surface mount adhesives (SMA) are formulated for precision, speed, and reliability in your manufacturing process. Whether you require electrically conductive solutions for advanced heat management or insulating adhesives for robust component protection, our products are optimised for a wide range of applications, ensuring superior performance and exceptional yields.

If you have any questions, please contact us to discuss your specific needs.

Die Attach Adhesives

Close-up of a microchip or sensor mounted on a leadframe with silver epoxy adhesive.

Our advanced die attach adhesives are engineered to meet the rigorous demands of modern electronics manufacturing. Optimised for high-speed dispensing and jetting, these adhesives ensure maximum efficiency on the production line. We offer a versatile range of solutions, including electrically conductive adhesives for superior electrical and thermal performance, and insulating adhesives that provide robust mechanical support while ensuring electrical isolation. Key properties such as rapid curing, ideal viscosity, and exceptional thermal management capabilities—including high glass transition temperature (Tg​) and thermal conductivity—are all carefully balanced to deliver a reliable, high-performance bond for any application.

We also offer advanced sintering materials. For more information, please visit our Sintering Materials page.

Key Properties

  • Formulation: 1- and 2-component adhesives, B-stage curing formulation

  • Applying Methods: Dispensing, jetting, stencil printing, screen printing

  • Curing:

    • 1-component: As fast as 1 min at elevated temperatures > 150°C

    • 2-component: 24 hours at room temperature or faster at elevated temperatures

    • B-stage curing: 90°C for 2 hours followed by 150°C for 3 hours

  • Volume Resistivity: Typically less than 5×10−4 Ohm-cm, ensuring efficient electrical conductivity.

  • Work Life: Our adhesives offer a work life that ranges from 45 minutes to 5 days, accommodating various production line speeds and processes.

  • Application-Specific Options:

    • Low-Temperature Cure:

      • 80°C for 1-component material

      • Room temperature for 2-component

    • High temperature performance: Options with high Tg of 250°C for up to 300°C high temperature resistance.

    • Low outgassing: Meeting strict NASA or ESA outgassing standards

    • Flexibility: To overcome coefficient of thermal expansion (CTE) mismatch

    • Variety of viscosity and thixotropic index for different application methods.

    • Process Versatility: B-stage curing options for a more flexible assembly process.

    • Flammability Safety & Compliance: UL94-V0 certified die attach adhesives.

Please contact us here to discuss the specific products and the possibility of a customised development.

Surface Mount Devices (SMD) Adhesives

Close-up of an automatic dispensing robot carrying a syringe of red SMD adhesive.

Our advanced surface mount adhesives (SMA) are engineered to meet the demands of high-speed electronics assembly. These adhesives are optimised for a range of application methods, including high-speed dispensing, jetting, and printing. All our SMA products are compatible with Pb-free wave soldering processes and provide exceptional green strength, ensuring components remain securely in place during the critical pick-and-place stage and subsequent thermal cycling. We offer a comprehensive portfolio tailored to specific manufacturing needs, including fast-curing formulations for high-throughput lines and options with varying viscosities to suit different equipment and processes.

Key Properties

  • Formulation: 1- and 2-component adhesives

  • Applying Methods: Dispensing, jetting, stencil printing

  • Curing: As fast as 10 seconds at 170°C

  • Work Life: Work life ranges from 5 to 10 days.

  • Application-Specific Options:

    • Low Exothermic Energy: Minimises heat generated during the curing process, protecting sensitive components from thermal stress.

    • Colour: Available in a range of colors, including Yellow, Black, and Red, for process control and compatibility with automated optical inspection (AOI) systems.

    • Low-Temperature Curing: Cures at temperatures as low as 80°C, providing a fast cure for high-speed production lines.

    • Viscosity: A variety of viscosity and thixotropic index options are available for different application methods.

Please contact us here to discuss the specific products and the possibility of a customised development.